Toshiba Electronic Devices and Storage Corporation has launched ‘TC35681IFTG’, a new IC for automotive applications, and added it to the company’s range of ICs which are compliant with Bluetooth low energy (LE) core. The new chip belongs to the version 5.0 (v5.0) specification and can be used in demanding automotive environments, as it can tolerate a wide operating temperature range, has high RF transmission power and high RF reception sensitivity (a link budget of 113dB @125kbps at long range transmission). The mixed-signal TC35681IFTG contains both analogRF and baseband digital parts to serve as a complete solution on a single chip.
Besides performing the basic functions of Host Controller Interface (HCI) profile and GATT profile functions, TC35681IFTG performs new functions defined by Bluetooth core specification 5.0, like 2 Mbps throughput, long range and advertising extension functions, stored in internal mask ROM. It also comes with a high gain power amplifier and realises +8dBm for long distance communication.
When the chip is used in tandem with an external non-volatile memory, the new IC takes on the form of a fully-fledged application processor that can temporarily load applications and store them in its internal RAM. It can also be combined with an external host processor.
According to Toshiba, the TC35681IFTG can be a part of sophisticated systems thanks to the integration of 18 General Purpose IO (GPIO) lines and multiple communications options including SPI, I2C and a 921.6kbps two-channel UART. The GPIO lines give users access to many on-chip features like a wake-up interface, four-channel PWM interface and 5-channel AD converter. An on-chip DC-DC converter or LDO circuits adjust the external voltage supply to the required values on the chip.
Toshiba says the chip is compliant with AEC-Q100. The AEC-Q100 norms were developed by the Automotive Electronics Council (AEC) and comprise a set of qualification test sequences for integrated circuits. The low energy IC is meant mainly for use in automotive applications. The wettable flank package makes it easier to conduct automatic visual inspection that is needed to maintain high levels of soldering quality thus increasing the tolerance to vibration experienced in an automotive setting.
Current applications for which the chip can be used range from tire pressure monitoring systems to on-board diagnostics which involves collection of data from sensors, remote keyless entry and other processes which can enhance vehicle comfort and safety.
Hamid Moaref has always been fascinated by cars and the automotive industry. His family has a longstanding association with the industry and has been in the tire business for the past 35 years. Raised in Dubai, Hamid attended Capilano University in Vancouver where he graduated with a BBA in marketing before attending an intensive course in magazine publishing in 2005. He has been the publisher and chief editor of Tires & Parts magazine for the past ten years.
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