Leading components manufacturer, Denso has set up the Denso Mobility Collaborative Research Centre in collaboration with the Tokyo Institute of Technology (Tokyo Tech). The center has been established as part of the university’s industry liaison program. The Collaborative Research Cluster has been set up with the goal of promoting joint research and will receive support from Tokyo Tech’s Open Innovation Platform for all aspects of the research process ranging from research planning to commercialization.
Denso has previously worked with Tokyo Tech on research related to many projects ranging from thermal management technology to packaging technology for in-vehicle computers. The two organizations have finalized an organizational partnership agreement to expedite their joint research for future mobility, especially in relation to CASE (connected, automated, shared, and electric) vehicles. They will make coordinated efforts to conduct comprehensive research in a wide range of fields at the Collaborative Research Cluster.
To be more specific, the Collaborative Research Cluster will have, on the Ookayama campus of Tokyo Tech, a dedicated space that will be used for conducting applied research on heat dissipation technology for automotive components. It will also be used to explore themes in new research related to different fields of specialization including electronics, semiconductors, electricity, mechanics, and communication.
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