TriLumina to Showcase Breakthrough Illumination Module at CES 2017

TriLumina will be collaborating with LeddarTech to showcase its innovative 256-pixel, 3D LiDAR solution for autonomous driving applications at the forthcoming 2017 edition of the CES Show in Las Vegas. TriLumina Group is one of the market leaders when it comes to high-power, pulsed, solid-state, low-cost illumination modules for LiDAR and has come up with a breakthrough laser illumination module. The company’s high-resolution 3D LiDAR represents a true breakthrough in automotive sensing.  It can enable next-generation ADAS and autonomous vehicles and this LiDAR platform can expedite the path to wide deployment by providing a reliable, high-performance, low-cost system. OEMs need such a high-performance low-cost system for mass-market ADAS applications demanded by automotive manufacturers.

TriLumina’s new powerful illumination modules will be an integral part of low cost LiDAR sensor systems that can be used for a wide variety of applications on any vehicle platform.  They can be used to replace the expensive, and bulky scanning LiDARs that are currently being used in the autonomous vehicles that are currently being tested. When compared to these conventional LiDAR units, they offer high resolution and long-range sensing in a small, but strong and cost-effective package, thus making commercial deployment of such units in semi-autonomous and autonomous vehicles a strong possibility.

According to Brian Wong, CEO of TriLumina, the company’s illumination modules can solve  some of the most difficult technical hurdles which are faced in the development of solid state LiDARs. The company builds complete Illumination modules with its patented, back-emitting, flip-chip VCSEL arrays and driver circuits to provide customers with the most efficient and most powerful illumination solutions available.  At the CES Show, TriLumina will demonstrate the immense potential of its 3D solid-state LiDAR solutions and how they can be rapidly deployed to enable new signal processing capabilities like those in the LeddarCore ICs.”