Electrifying the auxiliary units and replacing mechanic components such as hydraulic power steering by electric designs is by far one of the latest trends in automotive electronics today. This has driven ON Semiconductor to expand its portfolio of power integrated modules (PIMs).
The all-new STK984-190-E module is designed for use in 12 V automotive electric motor drive applications with power ratings up to 300 W, such as fans, windscreen wipers, and pumps. It contains six 40 V, 30 A MOSFETs configured as a three-phase bridge with an extra 40 V, 30 A high-side reverse battery protection MOSFET. The latter ones are mounted onto a direct bonded copper (DBC) substrate, leading to a compact module with high thermal performance taking up just half of the board space utilized by an equivalent discrete solution.
Utilized in combination with motor controllers, such as LV8907UW, designers can develop high efficiency BLDC solution with best in class thermal performance, built-in diagnostics, and an ultra-small PCB that saves significant size and weight.
Utilizing the module enables both the component count and the bill of material costs to be cut significantly. The DBC substrate also reduces the thermal resistance, which in turn decreases the operating temperature of the MOSFETs. As a result, this reduces power losses while increasing reliability due to a reduced change in temperature during thermal cycling. Reliability is also enhanced by the isolation given by the DBC substrate. STK984-190-E’s operational temperature range is -40°C to 150°C.
Between 13 and 15 discrete components would normally be required to develop an effective BLDC drive solution, whereas the STK984-190-E automotive power module requires less than half that. Apart from its compact size, the strong thermal performance of the STK984-190-E enables a smaller heatsink to be used.
